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Three Indispensable Material Technologies in Advanced Packaging
In the past, Henkel’s products have been mostly consumer products, such as Schwarzkopf, Si
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- Henkel presents at SEMICON China 2023
Especially with the development trend of artificial intelligence, high-performance computing (HPC) and automobile electrification and intelligence, the demand for advanced packaging is also increasing. According to Yole Intelligence, from 2022 to 2028, the compound annual growth rate of the advanced packaging market will reach 10.6%, and the market value will reach 78.6 billion US dollars. Henkel is also actively deploying in the field of advanced packaging. Ram Trichur, Global Marketing Director of Semiconductors at Henkel Adhesive Electronics Division, said: "In the field of advanced packaging, Henkel is actively cooperating with our global customers. We also hope to use these experiences Share it with customers in China."
According to Ram Trichur, there are three main types of materials used by Henkel in the field of advanced packaging. The first type is underfill (underfill), the second type is wafer encapsulation materials, and the third type is cover plates and reinforcement rings. bonding. Among them, Henkel's underfill solution can currently match the most advanced manufacturing process in the industry, and its flow speed is more than 30% faster than competitors, which can help customers improve production efficiency and reduce costs.
Henkel Advanced Packaging Materials Solutions
Henkel's wafer encapsulation materials can be divided into two categories, one is liquid compression molding, and the other is printing molding. Ram Trichur emphasized that one of the outstanding advantages of Henkel's liquid encapsulant material is its industry-leading low warpage characteristics. Taking a 12-inch wafer as an example, using Henkel's liquid encapsulant material can achieve a warpage of less than 1mm, which can help customers significantly improve yield.
For the third type of bonding of the cover plate and the reinforcing ring, Ram Trichur took the conductive adhesive (ECA) as an example. He said that Henkel has a complete portfolio of conductive adhesives, which can be used for different FC-BGAs and even different advanced packages. Architecture, providing customized products.
Chiplet, as one of the new ways of advanced packaging, has also attracted much attention recently. Ram Trichur said that Chiplet is different from the traditional system-on-chip SoC. It divides a whole chip SoC into many small chips, and then splicing them together to form a system-on-chip similar to SoC. Because many different small chips need to be spliced, all the three types of packaging materials mentioned above will be used in packaging, and the entire splicing process is also very different.
Taking underfill as an example, there will be an interposer in the chiplet, so that the connection between chips will involve bonding from Die to interposer and from interposer to substrate, which is equivalent to a few more The application scenario of underfill. With more application scenarios, the types of solutions for underfill materials involved will increase accordingly. According to Ram Trichur, Henkel has a complete set of matching solutions, which mainly include three types: one is film-type underfill, that is, a film is pre-attached to the back of a chip or wafer, and then directly attached to the substrate or on the interposer; the second is that some customers hope to pre-coat the underfill on the substrate or interposer, and then stick it to the chip or wafer. The third method is post-coating, that is, the electrical connection is completed first, and then the underfill glue is flowed in. This method has higher requirements for the flow speed.
After the chiplet is completed, generally the size of the entire package will be relatively large, and if the size is large, it will face a challenge, that is, warping. If the warpage is not well controlled, it will affect the next solder ball soldering, and it is easy to cause the problem of virtual soldering. In order to control the warpage, the industry generally uses a cover plate or a reinforcement ring to hold the warpage. At this time, Henkel’s cover plate/reinforcing ring adhesive will be used.
Ram Trichur said that from the perspective of the entire industry, Chiplet can be regarded as a subset of advanced packaging. Regardless of other advanced packaging technologies, such as flip chip CSP, BGA, etc., Henkel can provide complete adhesive material solutions, especially for Chiplets, Henkel has many customized innovation projects.
At present, Henkel's series of material solutions for advanced packaging have been adopted by its major global customers, and Henkel also hopes to share these advanced solutions with Chinese customers. Dr. Ni Kefan said that Henkel attaches great importance to the development of the Chinese market. Henkel currently has 3 R&D centers in Shanghai. Last year, Henkel established the South China Application Technology Center in Dongguan to better meet customer needs in South China. In addition, in terms of production, Henkel has multiple production bases in China, including Yantai, Shanghai, and Zhuhai, Guangdong, which can meet the supply of most glues.